Sung Kyu Lim's Design for High Performance, Low Power, and Reliable 3D PDF

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By Sung Kyu Lim

This publication offers readers with numerous algorithms and software program instruments, devoted to the actual layout of through-silicon-via (TSV) established, third-dimensional built-in circuits. It describes quite a few “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs built with the instruments coated within the booklet. This publication also will function sign-off point research of timing, energy, sign integrity, and thermal research for 3D IC designs. complete information of the comparable algorithms might be supplied in order that the readers should be capable not just to know the middle mechanics of the actual layout instruments, but in addition in an effort to reproduce and enhance upon the implications themselves. This booklet also will provide quite a few design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) concepts which are thought of severe to the actual layout process.

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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits by Sung Kyu Lim

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