Brandon Noia,Krishnendu Chakrabarty's Design-for-Test and Test Optimization Techniques for PDF

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By Brandon Noia,Krishnendu Chakrabarty

This ebook describes cutting edge concepts to handle the trying out wishes of 3D stacked built-in circuits (ICs) that make the most of through-silicon-vias (TSVs) as vertical interconnects. The authors establish the most important demanding situations dealing with 3D IC trying out and current effects that experience emerged from state-of-the-art examine during this area. insurance contains themes starting from die-level wrappers, self-test circuits, and TSV probing to test-architecture layout, try scheduling, and optimization. Readers will take advantage of an in-depth examine test-technology options which are had to make 3D ICs a fact and commercially manageable.

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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs by Brandon Noia,Krishnendu Chakrabarty


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