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By Nauman Khan,Soha Hassoun

This e-book explores the demanding situations and provides most sensible options for designing Through-Silicon Vias (TSVs) for 3D built-in circuits.  It describes a singular strategy to mitigate TSV-induced noise, the GND Plug, that's better to others tailored from 2-D planar applied sciences, reminiscent of a bottom floor airplane and standard substrate contacts. The ebook additionally investigates, within the type of a comparative examine, the impression of TSV dimension and granularity, spacing of C4 connectors, off-chip energy supply community, shared and devoted TSVs, and coaxial TSVs at the caliber of energy supply in 3D ICs. The authors offer specified top layout practices for designing three-D energy supply networks.  on the grounds that TSVs occupy silicon real-estate and effect gadget density, this booklet presents 4 iterative algorithms to reduce the variety of TSVs in an influence supply community. in contrast to different latest tools, those algorithms may be utilized in early layout levels whilst basically sensible block- point behaviors and a floorplan can be found. eventually, the authors discover using Carbon Nanotubes for strength grid layout as a futuristic replacement to Copper.

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Designing TSVs for 3D Integrated Circuits (SpringerBriefs in Electrical and Computer Engineering) by Nauman Khan,Soha Hassoun


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